Electronic Manufacturing/Defence Production Support

Services
   AutoTEC provides Electronic Manufacturing/Defence Production Support services including rapid prototyping, product engineering and documentation. Apart from these, we also provide support for component sourcing, assembly, testing, packaging, installation & commissioning to leading Research & Development Establishments, Public Sector Organizations & OEMs.

   Our alliance partners, M/s HBL Electronics manufacturing unit at Hyderabad have state of the art facility for Electronic Assembly services across through hole, SMD, mixed, BGA technologies. This facility at Hyderabad is an ISO 9001-2000 Certified process centre with 36,000 Sq ft of built up space for handling flexible manufacturing requirements of high mix technologies. Also, this facility has 3000 sq ft of air-conditioned space and a power connectivity of 250KVA for day to-day operations.

For environmental testing, the following facilities are also available :
Hot air oven
Hot cold chamber -40° c to +70° c, 175ltrs
Temperature humidity chamber
Vibration test system

   On our part, AutoTEC shall compile and document the various engineering & technology aspects of the product/equipment, based on the customer supplied functional prototype documentation. The Product Engineering & Technology document shall be used for the manufacture/production of electronic assemblies/ products. This document contains Bill of Material (BOM), schematic diagrams, placement drawings, electronic circuit implementation description, circuit simulation/timing details, programming details of devices like PAL, CPLD, FPGA, PROM, etc. Also, it includes mechanical packaging drawings, process documents for assembly & testing, Acceptance Test Plan (ATP), debug & diagnostic test plan and product installation drawings. The specifications & other requirements of special type test equipment/test jigs, product certification & approval are part of the document.

   Starting from Product Engineering & Technology document, AutoTEC can evolve the product manufacturing process & document the procedures, which are required for the manufacture, inspection and qualification of electronic equipment/assemblies. This document contains procedures/processes for Inward Goods Inspection (components/chassis etc), Component Kitting as per BOM, PCB manufacture (commercial/ MIL grade as per MIL-P-55110F standards), bare-board inspection, electronic board assembly & inspection, mechanical assembly of chassis & inspection.

   The document also provides test procedures/test software for functional testing towards acceptance of hardware and debug/diagnostics of hardware along with necessary test stimuli/response generation equipment. Also, this document includes the qualification test procedures (as per MIL-STD-2164), environmental stress screening procedures (as per MIL-STD-810 D/E), EMI/EMC test procedures (as per MIL-STD-461/462), power supply test procedures (as per MIL-STD-704D), component screening requirements (as per MIL-STD-883B) etc. The line integrated maintenance/testing (including the rig testing) of the military product; customer inspection & certification processes and procedures are part of this document. Along with this, we also provide the installation procedures of the equipment and training for usage of the equipment.